Date/Time
Date(s) - 09/26/2023
3:00 pm - 4:00 pm
Location
Rhines Hall 125
Categories
Abstract
Major advancements in Heterogenous Integration (HI) are necessary to meet the seismic shifts in information and communication technologies (ICT), which are the source of exponential growth in data that must be processed. One major design issue is how HI platforms can scale with finer die pitches, particularly as these pitches scale down from 20um and below. Ideally, one would like to stack die of different types to create a 3D stack of Known Good Die (KGD).
To achieve this grand goal, it will be necessary to incorporate a host of technical disciplines to make this a manufacturing reality. A discussion will be presented on the HI platforms that will facilitate the future industry goals. An overview of the materials science challenges that need to be addressed to achieve robust HI processes that produce reliable and high-yielding electronic packages will be presented. Semiconductor Research Corporation, “The Decadal Plan for Semiconductors.”
Bio
Chuck Woychik, Ph.D.
Senior Director of Advanced Packaging Platforms
Skywater Technology
Dr. Chuck Woychik is Sr. Director of Advanced Packaging Platforms at SkyWater Technology in Kissimmee, FL. Prior to joining SkyWater, he was the Chief Scientist at i3 Microsystems in St. Petersburg, FL. Other previous positions that he held were Senior Director of 3D Technologies at Invensas Corporation and Senior Scientist at GE Global Research Center. Most of his career was at IBM Endicott, NY, where he held both engineering and managerial positions. His area of expertise is materials and processes for advanced electronics packaging.
He holds a Doctorate and Master of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor of Science degree in Metallurgical Engineering from the University of Wisconsin-Madison. Chuck has presented at numerous conferences and has many publications. He has 123 U.S.-issued patents to his credit.